Research

Welcome to the RF, Microwave Devices, and Semiconductor Packaging Research Lab. We are located at IISER-Bhopal. We are a lush green campus in the “city of lakes”. We are an interdisciplinary research lab focusing on next-generation RF/Microwave devices and packaging technologies, with a focus on bench-to-market deliverable products. Our lab employs interdisciplinary approaches to achieve this, including multiple disciplines such as Electrical Engineering, Materials Science, Semiconductor Technologies, and Physics.

  • Our lab is committed to providing a platform for collaboration and knowledge sharing.
  • We believe in the power of interdisciplinary research and aim to create a space where ideas flourish and groundbreaking discoveries are made.
  • From exploring new materials for RF devices to optimizing semiconductor packaging techniques, we are at the forefront of driving technological advancements.

Major Focus Areas

RF Sensors and Biomedical Devices

RF sensors and biomedical devices play a critical role in enabling non-invasive, minimally invasive, and implantable healthcare technologies for both monitoring and healthcare applications. Recent advances in RF sensors, magneto-electric substrates, and sensing technologies offer exciting opportunities to develop miniaturized, biocompatible, and sensitive biomedical platforms with operating frequencies in the Medical Implant Communication Service (MICS) band. RF-based biomedical devices are used for physiological parameter monitoring, telemetry, and implantable devices.

Additive Manufacturing

Additive Manufacturing is emerging as a vital tool for future RF and Microwave devices. It allows the production of 3D RF components, including antennas, waveguides, resonators, and packaging structures. The ability to print a wide range of materials, from dielectrics and magnetic materials to composites, would enable device miniaturization and bandwidth enhancement, thereby improving power transfer, extending working distances, and reducing losses.

RF Device Packaging

RF device packaging is a vital aspect of high-frequency platform designs that directly influences performance, quality, reliability, and system integration. High-frequency RF devices are very susceptible to parasitic effects such as capacitance, inductance, signal coupling etc. Advanced semiconductor packaging techniques enable compact, high-performance RF systems by utilizing methods such as RF-in-package (RF-SiP), system-in-package (SiP), and heterogeneous integration. These approaches allow the integration of RF front-end components, antennas, passives, and control electronics within a single package.

Wireless Communications and Power Transfer:

Near-field communications (NFC) that enable wireless communication are a trillion-dollar industry related to 5G communications, the Internet of Things (IoT), and sensors. Some applications of these technologies are built-in wireless charging for the latest mobile phones, identity tags and access control, wearable medical sensors, and so on. There is a growing demand to increase working distance and the number of operating bands while expanding the operating range and reducing the size and power of wireless communication devices. Soft magnetic ferrites and other magnetic materials offer exciting avenues