RF & Semiconductor Packaging Lab IISER Bhopal
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About the lab

An interdisciplinary team turning fundamental materials science into deployable RF and semiconductor packaging technologies.

Who we are

Research at the intersection of four disciplines

Welcome to the RF, Microwave Devices, and Semiconductor Packaging Research Lab at IISER Bhopal — a lush green campus in the “city of lakes.” We focus on next-generation RF/microwave devices and packaging technologies, with an emphasis on bench-to-market deliverable products.

  • Interdisciplinary work across Electrical Engineering, Materials Science, Semiconductor Technologies, and Physics.
  • A platform for collaboration and open knowledge sharing.
  • From new RF materials to optimized packaging — driving real technological advancement.
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Vision

To create a space where interdisciplinary ideas flourish and groundbreaking discoveries move from the bench to deployable, market-ready RF systems.

Academic Building 4, IISER Bhopal — 462066

The people

Our team

The researchers driving the lab's work in RF devices and semiconductor packaging.

Dr. Poonam Lathiya

Dr. Poonam Lathiya

Principal Investigator / Lab Director

Dr. Poonam Lathiya earned her B.S. and M.S. in Physics from Delhi University, then completed her Ph.D. at the University of South Florida, Tampa, working at the Center for Wireless and Microwave Information Systems. Her doctoral research focused on next-generation magneto-dielectric substrates for RF/microwave devices and antenna design. She received honors from IEEE and the American Physical Society, and a 3-Minute Thesis award from USF. Before joining IISER Bhopal, she worked for over two years as a Quality Reliability & Substrate R&D Engineer at Intel Corporation, gaining expertise in substrate manufacturing, pathfinding, advanced graphics, and advanced semiconductor packaging technologies.

poonam@iiserb.ac.in
Ishita Jain

Ishita Jain

PhD Scholar

Project: Development of Magneto-Electric Biomedical Devices.

ishita@iiserb.ac.in
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