From biomedical RF sensors to advanced semiconductor packaging, we bridge Electrical Engineering, Materials Science, and Physics to build bench-to-market deliverable devices.
Welcome to the RF, Microwave Devices, and Semiconductor Packaging Research Lab at IISER Bhopal. We are an interdisciplinary group focused on next-generation RF/microwave devices and packaging technologies, with an emphasis on bench-to-market deliverable products.
We combine Electrical Engineering, Materials Science, Semiconductor Technologies, and Physics to solve high-frequency device challenges end to end.
Academic Building 4, IISER Bhopal — 462066
Spanning healthcare, manufacturing, integration, and connectivity — our work turns fundamental materials science into deployable RF systems.
Non-invasive, minimally invasive, and implantable healthcare technologies. We develop miniaturized, biocompatible RF platforms operating in the MICS band for physiological monitoring, telemetry, and implantable devices.
3D-printed RF components — antennas, waveguides, resonators, and packaging structures. Printing dielectrics, magnetic materials, and composites enables device miniaturization, bandwidth enhancement, and lower losses.
High-frequency packaging that directly shapes performance and reliability. Using RF-SiP, system-in-package, and heterogeneous integration to combine RF front-ends, antennas, passives, and control electronics in one package.
Near-field communications for 5G, IoT, and sensors — a trillion-dollar space. We push working distance, multi-band operation, and efficiency using soft magnetic ferrites and engineered magnetic materials.
Ph.D. from the University of South Florida, focused on next-generation magneto-dielectric substrates for RF/microwave devices and antenna design. Former Quality Reliability & Substrate R&D Engineer at Intel Corporation, with expertise in substrate manufacturing, pathfinding, advanced graphics, and semiconductor packaging.
Recognized by IEEE and the American Physical Society, and winner of a 3-Minute Thesis award — she brings industry-grade rigor to fundamental RF research.
We welcome students, researchers, and industry partners who want to push the boundaries of RF and semiconductor packaging technology.
